This document provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concerns of process engineers and others coming into the field of low-residue processes from two different areas: those who currently clean finished electronic assemblies using water-based semi-aqueous or other environmentally acceptable solvents and defluxing technologies; or those who use a standard residue level (SR) no-clean assembly process. Both types of manufacturers should understand the advantages and pitfalls of using low-residue soldering materials. This guide allows electronics manufacturers to choose the process/materials that will best suit their needs.

Product Details

Published:

12/01/1998

Note:

This product is unavailable in Russia, Ukraine, Belarus