This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component’s board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC.

Product Details

Published:

09/01/2011

Number of Pages:

24

File Size:

1 file , 2.4 MB

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