This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

Product Details

Published:

02/01/2022

ISBN(s):

9781638160724

Number of Pages:

24

File Size:

1 file , 1 MB

Product Code(s):

9701-STD-0-D-0-EN-B, 9701-STD-0-D-0-EN-B

Note:

This product is unavailable in Russia, Ukraine, Belarus