This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document applies to both surface-mount (SM) and through-hole (TH) components that are wave soldered, reflowed or hand soldered. This document is intended to complement other industry documents. Note: This document does not address the increased temperature requirements of lead-free solders.

Product Details

Published:

04/01/1999

Number of Pages:

12

File Size:

1 file , 210 KB

Part of:

IPC M109, IPC 9500-K

Product Code(s):

9502(D)1

Note:

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