1.1 Scope This document is intended to define standardmethods for the categorization of defects related to electronicprinted board assemblies (PBAs). This documentwill provide consistent methodologies for calculating thefollowing benchmark indices: Defects Per Million Opportunities Index (DPMO Index) Component DPMO Placement DPMO Termination DPMOAssembly DPMO

DPMO as applied in this standard is a measurement takenon completed product. Only those defects detected or discoveredat an assemblys completed product evaluation areto be included in the calculations. A companion standard,IPC-9261 In-Process DPMO and Estimated Yield for PWAsis used to develop DPMO indices for measuring in-processassembly steps.

It is recognized that a manufacturing index can be obtainedthrough a variety of methods. Overall Manufacturing Index(OMI) is explained in detail in Appendix B.

This document is intended to be used in conjunction withassembly acceptance standards such as IPC/EIA J-STD-001 or IPC-A-610. This document is for benchmarking andis NOT intended to describe how to track or otherwise logdefect types or drive corrective action. In-process DPMO isoutside the scope of this document.

Product Details

Published:

01/01/2004

ANSI:

ANSI Approved

Number of Pages:

24

File Size:

1 file , 250 KB

Product Code(s):

7912A(D)1, 7912A(D)1

Note:

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