This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.

Product Details

Published:

02/01/1998

Number of Pages:

25

File Size:

1 file , 1.2 MB

Product Code(s):

6015(D)1

Note:

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