Description

BS PD IEC TR 63378-1 – Thermal standardization on semiconductor packages

This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published:

01/11/2022

ISBN(s):

9780539171525

Number of Pages:

24

File Size:

1 file , 2.4 MB

Product Code(s):

30434821, 30434821, 30434821

Note:

This product is unavailable in Ukraine, Russia, Belarus