Description

BS 5909 – Method for scale adhesion test for oxygen-free copper

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.

Product Details

Published:

04/30/1980

ISBN(s):

0580112659

Number of Pages:

2

File Size:

1 file , 290 KB

Product Code(s):

00027795, 00027795, 00027795

Note:

This product is unavailable in Ukraine, Russia, Belarus