ASTM F72

ASTM F72

Original price was: $58.00.Current price is: $34.80.

Digital PDFMulti-User AccessPrintable
Sale!
-40%

ASTM F72

Original price was: $58.00.Current price is: $34.80.

Standard Specification for Gold Wire for Semiconductor Lead Bonding

Published by Publication Date Number of Pages
ASTM 01/01/2021 11
Digital PDFMulti-User AccessPrintable
Category:

Description

ASTM F72 – Standard Specification for Gold Wire for Semiconductor Lead Bonding

1.1”This specification covers round drawn/extruded gold wire for internal semiconductor device electrical connections. Four classifications of wire are distinguished, (1) copper-modified wire, (2) beryllium-modified wire, (3) high-strength wire, and (4) special purpose wire.

Note 1:Trace metallic elements have a significant effect upon the mechanical properties and thermal stability of high-purity gold wire. It is customary in manufacturing to add controlled amounts of selected impurities to gold to modify or stabilize bonding wire properties, or both. This practice is known variously as ”’modifying,”’ ”’stabilizing,”’ or ”’doping.”’ The first two wire classifications denoted in this specification refer to wire made with either of two particular modifiers, copper or beryllium, in general use. In the third and fourth wire classifications, ”’high-strength”’ and ”’special purpose”’ wire, the identity of modifying additives is not restricted.

Product Details

Published:
01/01/2021
Number of Pages:
11
File Size:
1 file , 350 KB
Redline File Size:
2 files , 780 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus