Description
ASTM F459 – Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).
Note 1: Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.
Product Details
- Published:
- 03/01/2018
- Number of Pages:
- 5
- File Size:
- 1 file , 96 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
