Description
ASTM F3192 – Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
1.1 This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.
Product Details
- Published:
- 09/01/2016
- Number of Pages:
- 5
- File Size:
- 1 file , 110 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus