Description
ASTM F3147 – Standard Test Method for Evaluating the Reliability of Surface Mounted Device (SMD) Joints on a Flexible Circuit by a Rolling Mandrel Bend
1.1 This test method covers a means to test a completed Surface Mounted Device (SMD) joint for bond strength and inter-layer stress compatibility
Product Details
- Published:
- 06/01/2015
- Number of Pages:
- 3
- File Size:
- 1 file , 130 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus