IPC

Showing 301–315 of 333 results

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Round Robin Test on Steam Ager Temperature Control Stability
Published by Publication Date Number of Pages
IPC 01/01/1993 20
IPC TR-465-1
Original price was: $79.00.Current price is: $47.40.
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The Effect of Steam Aging Time and Temperature on Solderability Test Results
Published by Publication Date Number of Pages
IPC 01/01/1993 51
IPC TR-465-2
Original price was: $113.00.Current price is: $67.80.
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Evaluation of Steam Aging on Alternative Finishes, Phase 11A
Published by Publication Date Number of Pages
IPC 07/01/1996 17
IPC TR-465-3
Original price was: $93.00.Current price is: $55.80.
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Technical Report: Wetting Balance Standard Weight Comparison Test
Published by Publication Date Number of Pages
IPC 04/01/1995 16
IPC TR-466
Original price was: $79.00.Current price is: $47.40.
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Supporting Data and Numerical Examples for ANSI./J-STD-001B: Appendix D (Control of Fluxes)
Published by Publication Date Number of Pages
IPC 11/01/1996 12
IPC TR-467
Original price was: $93.00.Current price is: $55.80.
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Factors Affecting Insulation Resistance Performance of Printed Boards
Published by Publication Date Number of Pages
IPC 03/01/1979 28
IPC TR-468
Original price was: $79.00.Current price is: $47.40.
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Thermal Characteristics of Multilayer Interconnection Boards
Published by Publication Date Number of Pages
IPC 01/01/1974 20
IPC TR-470
Original price was: $79.00.Current price is: $47.40.
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An Overview of Discrete Wiring Techniques
Published by Publication Date Number of Pages
IPC 03/01/1979 40
IPC TR-474
Original price was: $79.00.Current price is: $47.40.
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Results of Multilayer Test Program Round Robin
Published by Publication Date Number of Pages
IPC 04/01/1981 86
IPC TR-481
Original price was: $113.00.Current price is: $67.80.
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Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs - Includes addenda I and II
Published by Publication Date Number of Pages
IPC 03/01/1991 74
IPC TR-483
Original price was: $113.00.Current price is: $67.80.
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Results of IPC Copper Foil Ductility Round Robin Study
Published by Publication Date Number of Pages
IPC 04/01/1986 23
IPC TR-484
Original price was: $79.00.Current price is: $47.40.
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Results of Copper Foil Rupture Strength Test Round Robin Study
Published by Publication Date Number of Pages
IPC 03/01/1985 27
IPC TR-485
Original price was: $79.00.Current price is: $47.40.
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Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Published by Publication Date Number of Pages
IPC 07/01/2001 56
IPC TR-486
Original price was: $131.00.Current price is: $78.60.
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Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components
Published by Publication Date Number of Pages
IPC 07/01/1993 104
IPC TR-551
Original price was: $148.00.Current price is: $88.80.
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Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
Published by Publication Date Number of Pages
IPC 09/01/1988 80
IPC TR-579
Original price was: $131.00.Current price is: $78.60.
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IPC

Round Robin Test on Steam Ager Temperature Control Stability

IPC TR-465-1

The Effect of Steam Aging Time and Temperature on Solderability Test Results

IPC TR-465-2

Evaluation of Steam Aging on Alternative Finishes, Phase 11A

IPC TR-465-3

Technical Report: Wetting Balance Standard Weight Comparison Test

IPC TR-466

Supporting Data and Numerical Examples for ANSI./J-STD-001B: Appendix D (Control of Fluxes)

IPC TR-467

Factors Affecting Insulation Resistance Performance of Printed Boards

IPC TR-468

Thermal Characteristics of Multilayer Interconnection Boards

IPC TR-470

An Overview of Discrete Wiring Techniques

IPC TR-474

Results of Multilayer Test Program Round Robin

IPC TR-481

Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs - Includes addenda I and II

IPC TR-483

Results of IPC Copper Foil Ductility Round Robin Study

IPC TR-484

Results of Copper Foil Rupture Strength Test Round Robin Study

IPC TR-485

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

IPC TR-486

Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

IPC TR-551

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

IPC TR-579

Published by	Publication Date	Number of Pages
IPC	01/01/1993	20

Published by	Publication Date	Number of Pages
IPC	01/01/1993	51

Published by	Publication Date	Number of Pages
IPC	07/01/1996	17

Published by	Publication Date	Number of Pages
IPC	04/01/1995	16