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IPC

Showing 226–240 of 333 results

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Requirements for Soldering Fluxes
Published by Publication Date Number of Pages
IPC 01/01/2022 32
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IPC J-STD-004C
Original price was: $168.00.Current price is: $100.80.
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Requirements for Soldering Pastes
Published by Publication Date Number of Pages
IPC 02/01/2012 24
IPC J-STD-005A
Original price was: $93.00.Current price is: $55.80.
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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by Publication Date Number of Pages
IPC 01/01/2006 30
IPC J-STD-006B
Original price was: $79.00.Current price is: $47.40.
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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Published by Publication Date Number of Pages
IPC 07/01/2013 36
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IPC J-STD-006C
Original price was: $93.00.Current price is: $55.80.
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Implementation of Flip Chip and Chip Scale Technology
Published by Publication Date Number of Pages
IPC 01/01/1996 105
IPC J-STD-012
Original price was: $168.00.Current price is: $100.80.
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Implementation of Ball Grid Array and Other High Density Technology
Published by Publication Date Number of Pages
IPC 08/01/1996 123
IPC J-STD-013
Original price was: $131.00.Current price is: $78.60.
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Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
Published by Publication Date Number of Pages
IPC 01/01/2015 24
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IPC J-STD-020E
Original price was: $83.00.Current price is: $49.80.
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Semiconductor Design Standard for Flip Chip Applications
Published by Publication Date Number of Pages
IPC 04/01/1999 48
IPC J-STD-026
Original price was: $113.00.Current price is: $67.80.
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Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
Published by Publication Date Number of Pages
IPC 02/01/2003 20
IPC J-STD-027
Original price was: $93.00.Current price is: $55.80.
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Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
Published by Publication Date Number of Pages
IPC 04/01/1999 36
IPC J-STD-028
Original price was: $113.00.Current price is: $67.80.
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Selection and Application of Board Level Underfill Materials
Published by Publication Date Number of Pages
IPC 02/01/2014 48
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IPC J-STD-030A
Original price was: $168.00.Current price is: $100.80.
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Performance Standard for Ball Grid Array Balls (IPC/EIA J-STD-032)
Published by Publication Date Number of Pages
IPC 06/01/2002 10
IPC J-STD-032
Original price was: $79.00.Current price is: $47.40.
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Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Published by Publication Date Number of Pages
IPC 03/01/2018 32
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IPC J-STD-033D
Original price was: $93.00.Current price is: $55.80.
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Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
Published by Publication Date Number of Pages
IPC 04/01/1999 20
IPC J-STD-035
Original price was: $79.00.Current price is: $47.40.
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Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
Published by Publication Date Number of Pages
IPC 07/01/2016 14
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IPC J-STD-046
Original price was: $93.00.Current price is: $55.80.
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