This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores. 

The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.

Product Details

Published:

02/01/2022

ISBN(s):

9781638160601

Number of Pages:

60

File Size:

1 file , 2.7 MB

Product Code(s):

6018-STD-0-D-0-EN-D

Note:

This product is unavailable in Russia, Ukraine, Belarus