Will the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that components chosen meet expected reliability requirements after exposure to factory processes. This document specifically addresses preconditioning of components. Developed for users and manufacturers, the procedure consists of a set of simulations for IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes and exposure to often-used cleaning materials.

Product Details

Published:

07/10/1995

Number of Pages:

12

File Size:

1 file , 180 KB

Part of:

IPC M109, IPC 9500-K

Product Code(s):

9501(D)1

Note:

This product is unavailable in Russia, Ukraine, Belarus