Fine line, multilayer circuits and flex-based IC packages are big players in shrinking interconnection systems. The proceedings of this conference, held June 9-10, 1999 in Denver, CO, discuss meeting the challenges of the next generation of packaging. Also covered are the laser processing technologies used to create extremely fine features and small diameter blind and buried vias. Finally, new material constructions that provide reliable, low-cost substrates are featured.

Product Details

Published:

01/01/1999

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