THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.

Product Details

Published:

02/01/2003

Number of Pages:

20

File Size:

1 file , 90 KB

Product Code(s):

J-027(D)1, J-027(D)1

Note:

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