Description

BS PD IEC TR 61189-5-506 – Test methods for electrical materials, printed boards and other interconnection structures and assemblies

This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method. This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

Cross References:
IEC 60068-2-20:2008
IEC 61189-5-501

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published:

07/18/2019

ISBN(s):

9780539000689

Number of Pages:

26

File Size:

1 file , 5.1 MB

Product Code(s):

30373834, 30373834, 30373834

Note:

This product is unavailable in Ukraine, Russia, Belarus