Description

BS PD IEC TR 62878-2-7 – Device embedding assembly technology

BS PD IEC TR 62878-2-7:2019 describes the accelerated stress testing of passive embedded circuitboards. It can be used for screening finished boards, including multilayer and high-densityinterconnection (HDI) boards. These boards are mainly for mobile devices.

Cross References:
IEC 60194

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published:

04/01/2019

ISBN(s):

9780539033595

Number of Pages:

14

File Size:

1 file , 2.5 MB

Product Code(s):

30388756, 30388756, 30388756

Note:

This product is unavailable in Ukraine, Russia, Belarus